Plasma cleaning is a process that utilizes low-temperature plasma to clean and activate surfaces. It is widely used in various industries, including semiconductor manufacturing, electronics, medical devices, and more. In the context of bonding system change for LSM (Liquid Crystal on Silicon) and COF (Chip-on-Film) technologies, plasma cleaning plays a crucial role in ensuring successful bonding and optimal device performance.

atmospheric pressure plasma can indeed be used in the touch panel manufacturing process, offering various benefits and enhancing the overall production efficiency and quality. Atmospheric pressure plasma technology, also known as non-thermal or cold plasma, operates at ambient pressure, making it more convenient for industrial applications compared to low-pressure plasmas, which require vacuum chambers. (1) Cover lens coating process prior to cleaning (2) Touch sensor PR before the cleaning process (3) Clean before the fitting process (4) FPC connection terminal before the cleaning process

Plasma cleaners play a crucial role in the IC (Integrated Circuit) packaging and LED (Light Emitting Diode) packaging processes. These cleaners help ensure the cleanliness and quality of the components, which is essential for their functionality and reliability. Benefits of Plasma Cleaners in IC and LED Packaging: Efficient and selective cleaning without damaging sensitive components. Enhanced adhesion and bonding between various materials. Improved reliability and performance of packaged ICs and LEDs. Prevention of defects caused by contaminants and residues. Faster and more precise cleaning compared to traditional methods. (1) Process before Die Attachment (2) Process before Molding (3) Process before Wire Bonding

Surfaces of injection, stamping, and die-casting molds: reduce friction and extend service life. High-precision jigs, sliding bearings, and guide rails: minimize wear and static dust adhesion.

Applicable to automotive, footwear, and various plastics, enhancing surface cleanliness, activation, and adhesion for improved subsequent processing or coating.

Cell and tissue engineering: Assessing surface suitability for cell adhesion and growth. Protein adsorption: Predicting protein binding on material surfaces. Biomedical material development: Verifying surface modification to improve biocompatibility. Drug delivery evaluation: Influencing dissolution and release rates of films or capsules.

Wafer fabrication, also known as semiconductor manufacturing or wafer processing, is a complex and critical process used to produce integrated circuits (ICs) or microchips. This process involves a series of steps to transform semiconductor wafers into functional electronic devices. (1) Removal of residual photoresist (2) Blue film residue removal (3) PSS cleaning process incoming

Optical plastic substrates, valued for their lightweight and versatility, are widely used in displays, lenses, eyewear, and optical sensors. Cleaning and surface treatment are essential to remove contaminants and ensure uniform, durable coatings and prints, enhancing device performance and visual quality.

Surface cleaning, activation, and modification are essential steps in many industrial applications, ensuring optimal adhesion and performance of subsequent processes and coatings. Atmospheric plasma cleaning equipment offers an efficient, controlled solution without the need for a vacuum chamber.

Solar cells (PV cells) convert sunlight directly into electricity and form the core of solar panels. Edge isolation reduces edge-related current loss, improving efficiency. Plasma cleaning and vacuum sputtering are advanced techniques used to optimize edge isolation and enhance cell and panel performance.

Remove and decompose harmful substances from the environment, discharge them in an environmentally compliant manner, and ensure a production process that is both efficient and eco-friendly. Protect the environment and achieve sustainable manufacturing.

Nanopowder (nanoparticles) is widely used to enhance the mechanical and optical properties of materials due to its unique physical and chemical characteristics.

I. Plasma-Activated Water (PAW) (1) Doubled Chlorophyll Leaf chlorophyll levels doubled in treated tomato plants (2) +61% Wet Weight Overall plant wet weight significantly increased vs. control group (3) Sustainable Fertilizer Chemical-free, enriched with reactive oxygen and nitrogen species II. Seed Treatment (1) Cotton Seeds �� Cold Germination Plasma treatment doubled germination rates under cold test conditions, demonstrating enhanced seed vigor and wettability. (2) Soybeans �� Nodule & Nitrogen Fresh nodule biomass increased by 72%; nitrogenase activity boosted by 1.6-fold, improving biological nitrogen fixation. III. Post-Harvest Preservation (1) Vanda orchid PAW-nitrate extended Vanda orchid vase life 12.63d (2) Strawberry Bacteria Aerobic bacteria & mold reduction 3 log (3) Melon Lactobacilli Reduction in fresh-cut melons 7 log IV. Enhanced Extraction of Essential Oils (1) Lemon Peel Oil 149% Essential oil yield increase vs. microwave extraction (2) Lemon Verbena 36.7% Oil increase within 1 minute of treatment